MR18R1622DF0 DATU LAPA,CIKLU,FUNKCIJAS
MR18R1622DF0 Datasheet PDF
| Ražotājs | Packing | Apraksts | Temperatūra | |
|---|---|---|---|---|
| Timing Parameters |
MR18R1622DF0 PDF | Min°C | Max°C |
- Samsung semiconductor MR18R16224DF0
Timing Parameters - MR18R16228DF0
Timing Parameters - Samsung semiconductor MR18R1622AF0
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die - Samsung semiconductor MR18R1622AF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR18R1622AF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - MR18R1622DF0
Timing Parameters - Samsung semiconductor MR18R1622GDF0
Timing Parameters - Samsung semiconductor MR18R16248EG0
Timing Parameters - Samsung semiconductor MR18R1624AF0
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die - Samsung semiconductor MR18R1624AF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR18R1624AF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR18R1624AF1-CN9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR18R1624AF1-CT9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR18R1624EG0-CK8
Timing Parameters - Samsung semiconductor MR18R1624EG0-CM8
Timing Parameters